Engineer I-Product

Hauppauge, US

Req ID: 1273-21

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Company Description

Microchip Technology Inc. is a leading provider of embedded control applications. Our product portfolio comprises general purpose and specialized 8-bit, 16-bit, and 32-bit microcontrollers, 32-bit microprocessors, field-programmable gate array (FPGA) products, a broad spectrum of high-performance linear, mixed-signal, power management, thermal management, radio frequency (RF), timing, safety, security, wired connectivity and wireless connectivity devices, as well as serial Electrically Erasable Programmable Read Only Memory (EEPROM), Serial Flash memories, Parallel Flash memories, and serial Static Random Access Memory (SRAM). We also license Flash-IP solutions that are incorporated in a broad range of products.

Job Description

USB and Networking Business Unit within Microchip looking for a Product Engineer to drive all facets of Product Support

and New Product Development. This is a high visibility position within a dynamic business unit at Microchip.

  • Own New Product Development from design phase through mass production.
  • Work with Architecture, Design, Marketing, Test, Planning and Manufacturing to achieve common goal of successful product launch.
  • Lead effort with Applications and Quality Engineering teams to support customer returns and failure analysis.
  • Support Automotive requirements on new and existing products (PPAP / PCNs / Audits).
  • Interface with internal teams and external suppliers to resolve manufacturing issues that are technical (fab, test, design related) and non-technical (supply chain, system related).
  • Support foundry and assembly migrations efforts aimed at increasing the capacity for commercial, industrial and
  • automotive customer base.
  • Drive continuous improvement in product quality, cost and delivery while sustaining existing products.

Job Requirements

  • B.S. in Engineering or related field with 0-2 years of relevant experience and strong business acumen.
  • Outstanding written and verbal skills are a must with a focus on attention to detail.
  • Ability to communicate to various positions (planning, customer support, R&D Engineering, etc).
  • Experience with leading global teams through complex projects and crisis situations.
  • Flexibility to communicate with different time zones as needed.
  • Semiconductor packaging technology knowledge preferred.
  • Good understanding of semiconductor device physics and processing.
  • Automotive support knowledge with emphasis on die and package qualification.
  • Strong analytical skills to analyze validation, ATE datalogs and fab electrical test data.
  • Experience with bench laboratory equipment such as oscilloscopes, supplies and meters.
  • Ability to comprehend and review design objective specifications and data sheets.
  • Ability to decipher PCB schematics.
  • Knowledge with USB and Ethernet desirable but not required.
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